MOLEX

879143614

2.54mm Pitch C-Grid Header, Through Hole, Dual Row, Vertical, 36 Circuits, 0.38µm Gold (Au) Plating on Contact, 1.88µm Tin (Sn) on Solder Tail, Nickel Overall Plating, Tray Packaging, Lead-free
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Reference - Drawing Numbers

Application Specification
713080001-AS-000
Packaging Specification
PK-89990-489-001
Product Specification
PS-87920-019-001
Sales Drawing
SD-87914-013-000

Solder Process Data

Duration at Max. Process Temperature (seconds)
012
Lead-freeProcess Capability
WAVE
Max. Cycles at Max. Process Temperature
001
Process Temperature max. C
260

Agency Certification

UL
E29179

Electrical

Current - Maximum per Contact
3.0A
Voltage - Maximum
250V

Physical

Breakaway
Yes
Circuits (Loaded)
36
Circuits (maximum)
36
Color - Resin
Black
First Mate / Last Break
No
Flammability
94V-0
Glow-Wire Capable
No
Guide to Mating Part
No
Keying to Mating Part
None
Lock to Mating Part
None
Mated Height
5.84mm
Material - Metal
Copper Alloy
Material - Plating Mating
Gold
Material - Plating Termination
Tin
Material - Resin
High Temperature Thermoplastic
Net Weight
1.957/g
Number of Rows
2
Orientation
Vertical
PC Tail Length
2.79mm
PCB Locator
No
PCB Retention
None
PCB Thickness - Recommended
1.60mm
Packaging Type
Tray
Pitch - Mating Interface
2.54mm
Pitch - Termination Interface
2.54mm
Plating min - Mating
0.381µm
Plating min - Termination
1.905µm
Polarized to Mating Part
No
Polarized to PCB
No
Shrouded
No
Stackable
No
Surface Mount Compatible (SMC)
Yes
Temperature Range - Operating
-55° to +105°C
Termination Interface: Style
Through Hole

Product Environmental Compliance

EU ELV
Not Relevant
EU RoHS
Compliant
REACH SVHC
Not Contained Per -D(2020)9139-DC (19 Jan 2021)
Low-Halogen Status
Low-Halogen

Documents

Data Sheet

Download

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