NM-EFF1D
MD-P200US2 Ultrasonic Bonder
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Specifications
- Model ID
- MD-P200US2
- Model No.
- NM-EFF1D
- Productivity *
- 0.65 s / IC for thermosonic bonding
- Placement Accuracy *
- XY (3 at Panasonic conditions) - ±7 µm
- Substrate Dimensions (mm)
- L 50 × W 30 to L 120 × W 120
- Die Dimensions (mm)
- L 0.25 × W 0.25 to L 6 × W 6
- Number of Die Types
- 1 product type (manual wafer supply) / Up to 12 product types (AWC specifications)
- Die Supply
- Wafer frame (Max. 8 inch) , Tray
- Bonding Load
- VCM head for thermosonic process - 1 N to 50 N (Option - 2 N to 100 N)
- Head Heating
- Up to 300℃ for the VCM head
- Substrate Heating
- Constant heating, Up to 300℃
- Power Source *
- 3-phase AC 200 V ±10V, 50 / 60 Hz,
- Pneumatic Source
- 0.4 to 0.5 Mpa (Max. 0.8 Mpa), 30 L / min (A.N.R.)
- Dimensions (mm)
- W 1,340 × D 1,140 × H 1,400 (Including loader/unloader)
- Mass
- 1,750 kg (Including loader / unloader)