PCB terminal block - FFKDSA1/V-2,54-33 - 1710544
1710544
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Additional Information

Part Number
1710544
UPC
4046356078450
ETIM
Group Code : EG000058
Group Description : Connectors
Class Description : Printed circuit board terminal
Class Code : EC002643
Version : 7

Current carrying capacity / derating curves

Specification
IEC 60999-1 (in parts)

Material data - housing

Housing color
green (6021)
Insulating material
PA
Insulating material group
I
CTI according to IEC 60112
600
Flammability rating according to UL 94
V0
Glow wire flammability index GWFI according to EN 60695-2-12
850
Glow wire ignition temperature GWIT according to EN 60695-2-13
775
Temperature for the ball pressure test according to EN 60695-10-2
125 °C

Dimensions for the product

Length [ l ]
12.6 mm
Width [ w ]
86.32 mm
Height [ h ]
17 mm
Pitch
2.54 mm
Height (without solder pin)
13.6 mm
Solder pin [P]
3.4 mm
Pin spacing
5.08 mm
Pin dimensions
0.5 x 0.8 mm

Vibration test

Specification
IEC 60068-2-6:1982 + AMD 2:1985
Result
Test passed
Frequency
10 - 150 - 10 Hz
Sweep speed
1 octave/min
Amplitude
0.35 mm (10 - 60.1 Hz)
Acceleration
5 g (60.1 - 150 Hz)
Test duration per axis
2.5 h

Pull-out test

Pull-out test
IEC 60999-1:1990-05
Pull-out test
Test passed
Conductor cross section / conductor type / tensile force
0.14 mm² / solid / > 7 N
Conductor cross section / conductor type / tensile force
0.14 mm² / flexible / > 7 N
Conductor cross section / conductor type / tensile force
0.5 mm² / solid / > 30 N
Conductor cross section / conductor type / tensile force
0.5 mm² / flexible / > 30 N

Packaging information

Type of packaging
packed in cardboard
Pieces per package
10
Denomination packing units
Pcs.

Electrical tests

Rated current
6 A
Conductor cross section
0.5 mm²
Rated voltage (III/2)
160 V
Rated surge voltage (III/2)
2.5 kV

Air clearances and creepage distances

Clearances and creepage distances
IEC 60664-1:2007-04
Specification
IEC 60664-1:2007-04
Minimum clearance - inhomogeneous field (III/3)
1.5 mm
Minimum clearance - inhomogeneous field (III/2)
1.5 mm
Minimum clearance - inhomogeneous field (II/2)
1.5 mm
Minimum creepage distance value (III/3)
1.6 mm
Minimum creepage distance value (III/2)
1.5 mm
Minimum creepage distance value (II/2)
1.6 mm

Material data - contact

Note
WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material
Cu alloy
Surface characteristics
Tin-plated
Metal surface terminal point (top layer)
Tin (5 - 7 µm Sn)
Metal surface terminal point (middle layer)
Nickel (2 - 3 µm Ni)
Metal surface soldering area (top layer)
Tin (5 - 7 µm Sn)
Metal surface soldering area (middle layer)
Nickel (2 - 3 µm Ni)

Ambient conditions

Ambient temperature (storage/transport)
-40 °C - 70 °C
Ambient temperature (assembly)
-5 °C - 100 °C
Ambient temperature (operation)
-40 °C - 100 °C (Depending on the current carrying capacity/derating curve)

Connection capacity

Connection method
Push-in spring connection
Pluggable
Yes
Conductor cross section solid
0.14 mm² - 0.5 mm²
Conductor cross section flexible
0.14 mm² - 0.5 mm²
Conductor cross section AWG / kcmil
26 - 20
Stripping length
11 mm

Environmental Product Compliance

China RoHS
Environmentally friendly use period: unlimited = EFUP-e
China RoHS
No hazardous substances above threshold values

Electrical parameters

Nominal current
6 A
Nom. voltage
160 V
Rated voltage
63 V
Rated voltage (III/2)
160 V
Rated voltage (II/2)
320 V
Rated surge voltage (III/3)
2.5 kV
Rated surge voltage (III/2)
2.5 kV
Rated surge voltage (II/2)
2.5 kV

Temperature-rise test

Result
Test passed
Specification
IEC 60998-1:1990-04

Termination and connection method

Test for conductor damage and slackening
IEC 60999-1:1990-05
Test for conductor damage and slackening
Test passed

Standards and Regulations

Connection in acc. with standard
EN-VDE
Connection in acc. with standard
CSA
Flammability rating according to UL 94
V0

Item properties

Brief article description
PCB terminal block
Range of articles
FFKDS(A) 0,5/..-V
Pitch
2.54 mm
Number of positions
33
Connection method
Push-in spring connection
Mounting type
Wave soldering
Pin layout
Linear double pinning
Number of levels
1
Number of connections
33
Number of potentials
33

Dimensions for PCB design

Hole diameter
1.1 mm
Pin spacing
5.08 mm

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