- Note
- WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
- Contact material
- Cu alloy
- Surface characteristics
- Tin-plated
- Metal surface contact area (top layer)
- Tin (3 - 5 µm Sn)
- Metal surface contact area (middle layer)
- Nickel (1.3 - 3 µm Ni),
- Metal surface soldering area (top layer)
- Tin (3 - 5 µm Sn)
- Metal surface soldering area (middle layer)
- Nickel (1.3 - 3 µm Ni)