- Contact Base Material
- Copper Alloy C7025
- Crimp Area Plating Thickness
- 50 – 100 µin
- Wire Contact Termination Area Plating Material
- Tin
- Contact Type
- Socket
- Contact Mating Area Plating Material
- Gold
- Contact Current Rating (Max)
- 3 A
- Contact Style
- Crimp Snap-In
- Contact Termination Area Plating Material
- Gold
- Contact Mating Area Plating Thickness
- 30 µin
- Contact Transmits (Typical)
- Signal (Data)/Power