TE Connectivity
1-2134250-1
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Additional Information
- Part Number
- 1-2134250-1
Packaging Features
- Packaging Quantity
- 16
- Packaging Method
- Tray, Tray/Box
Dimensions
- Height above PC Board
- 14.6 mm [ .5748 in ]
Mechanical Attachment
- Mounting Angle
- Right Angle
- Locating Posts
- Without
- PCB Mount Retention
- With
- PCB Mount Retention Type
- Boardlocks
- Polarization
- Left
- Boardlock Material
- Copper Alloy
- PCB Mounting Style
- Surface Mount
Configuration Features
- Number of Keys
- 1
- Number of Rows
- 2
- Keying
- Standard
- Number of Positions
- 240
- Center Key
- Offset Left
- Number of Bays
- 2
- Module Orientation
- Vertical
Industry Standards
- UL Flammability Rating
- UL 94V-0
Contact Features
- Socket Type
- Memory Card
- Contact Base Material
- Copper Alloy
- Contact Mating Area Plating Material
- Gold
- Socket Style
- DIMM
- Solder Tail Contact Plating Material
- Gold Flash
- Contact Mating Area Plating Thickness
- .38 µm [ 15 µin ]
Termination Features
- Insertion Style
- Direct Insert
Body Features
- Retention Post Location
- Both Ends
- Ejector Material Color
- White
- Module Key Type
- Offset Left
- Ejector Location
- Both Ends
- Latch Color
- White
- Retention Post Material
- Copper Alloy
- Latch Material
- Liquid Crystal Polymer (LCP)
- Ejector Material
- High Temperature Thermoplastic
- Ejector Type
- Standard
Housing Features
- Housing Material
- High Temperature Thermoplastic
- Centerline
- 1 mm [ .039 in ]
- Housing Color
- Black
Product Type Features
- DRAM Type
- Double Data Rate (DDR) 3
- Applies To
- Printed Circuit Board
- Product Type
- Socket
- Profile
- Low
- Row-to-Row Spacing
- 6.2 mm [ .244 in ]
Electrical Characteristics
- DRAM Voltage (V)
- 1.5
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