TE Connectivity

1-5645955-2

Socket,Min-Spr B-N Sn-Au Ser-2
1-5645955-2
1-5645955-2
1-5645955-2
1-5645955-2
1-5645955-2
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Additional Information

Part Number
1-5645955-2

Other

Spring Material
Beryllium Copper

Packaging Features

Packaging Method
Reel
Packaging Quantity
10000

Dimensions

Socket Length
4.67 mm
Socket Length
.184 in
Hole Size (Recommended)
1.32 mm
Wire/Cable Size
.081 – .326 mm²
Hole Size (Recommended)
.052 in
Mating Pin Diameter Range
.36 – .66 mm
Wire/Cable Size
28 – 22 AWG
PCB Thickness (Recommended)
.79 – 3.18 mm
Mating Pin Diameter Range
.014 – .026 in
PCB Thickness (Recommended)
.031 – .125 in

Usage Conditions

Operating Temperature Range
-65 – 125 °C
Operating Temperature Range
-85 – 257 °F

Contact Features

Contact Base Material
Beryllium Copper
Contact Current Rating (Max)
5 A
Contact Spring Plating Thickness
.762 µm
Contact Spring Plating Thickness
30 µin
Contact Type
Socket
Contact Spring Plating Material
Gold
Socket Type
Discrete
Contact Transmits (Typical)
Signal (Data)/Power
Contact Mating Area Plating Thickness
30 µm
Contact Mating Area Plating Thickness
30 µin

Operation/Application

Circuit Application
Power & Signal

Termination Features

Termination Method to Printed Circuit Board
Through Hole - Press-Fit
Termination Method to Wire & Cable
Solder
Insertion Method
Hand/Semi-Automatic/Automatic

Body Features

Sealant
Yes
Sleeve Material
Copper
Sleeve Plating Material
Tin

Product Type Features

Sleeve Style
Bullet Nose
Connector System
Cable-to-Board
Sealable
No
Connector & Contact Terminates To
Printed Circuit Board
Product Type
Contact
Profile
Zero
Wire/Cable Type
Discrete Wire