TE Connectivity
2170684-1
Sfp+ Enhanced 1X4, Pci Heatsink, Lp
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Additional Information
- Part Number
- 2170684-1
Other
- EMI Containment Feature Type
- External Springs
- Included Lightpipe
- No
Packaging Features
- Packaging Method
- Box & Tray
Dimensions
- Tail Length
- 2.05 mm
- PCB Thickness (Recommended)
- 2.25 mm
- Tail Length
- .081 in
- PCB Thickness (Recommended)
- .089 in
Mechanical Attachment
- PCB Mounting Style
- Through Hole Press-Fit
- Connector Mounting Type
- Board Mount
Configuration Features
- Port Matrix Configuration
- 1 x 4
- Number of Ports
- 4
Usage Conditions
- Operating Temperature Range
- -55 – 105 °C
- Operating Temperature Range
- -67 – 221 °F
Operation/Application
- For Use With Pluggable I/O Products
- SFP+ SMT Connector
- Pluggable I/O Applications
- SFP+ Enhanced
- Circuit Application
- Signal
- Heat Sink Compatible
- Yes
Termination Features
- Termination Method to Printed Circuit Board
- Through Hole - Press-Fit
Body Features
- Heat Sink Style
- Fin
- Heat Sink Height Class
- Networking Short
- Heat Sink Height
- 4 mm
- Heat Sink Height
- .157 in
Housing Features
- Cage Material
- Nickel Silver
Product Type Features
- Form Factor
- SFP+
- Product Type
- Cage Assembly
- Cage Type
- Ganged
- Included Heat Sink
- Yes
- Connector System
- Cable-to-Board
- Sealable
- No
- Connector & Contact Terminates To
- Printed Circuit Board
Electrical Characteristics
- Data Rate (Max)
- 16 Gb/s
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