TE Connectivity
3-1981052-5
.5Fhp08H,200,S,Std,08/Sn,Ht,Nsyes
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Additional Information
- Part Number
- 3-1981052-5
Packaging Features
- Packaging Method
- Box & Tray
- Packaging Method
- Tray
- Packaging Quantity
- 30
Dimensions
- Stack Height
- 8 mm
- Height
- 7.45 mm
- PCB Thickness (Recommended)
- .2 in
- Stack Height
- .315 in
- Height
- .292785 in
- Mating Post Length
- 1 mm
- Mating Post Length
- 1.3 mm
Mechanical Attachment
- PCB Mount Retention Type
- Solder Peg
- Mating Alignment
- With
- Mating Alignment Type
- Polarization
- PCB Mount Retention
- With
- PCB Mount Alignment
- With
- PCB Mount Alignment Type
- Locating Posts
Configuration Features
- Stackable
- Yes
- PCB Mount Orientation
- Vertical
- Number of Positions
- 200
- Board-to-Board Configuration
- Mezzanine
- Number of Rows
- 2
- Post Entry Direction
- With
Usage Conditions
- Operating Temperature Range
- -40 – 85 °C
- Operating Temperature Range
- -40 – 185 °F
Industry Standards
- UL Flammability Rating
- UL 94V-0
Contact Features
- Contact Base Material
- Copper Alloy
- PCB Contact Termination Area Plating Material
- Tin
- Contact Shape
- Square
- Contact Mating Area Plating Material
- Gold
- Contact Mating Area Plating Thickness
- .2 µm
- Contact Mating Area Plating Thickness
- 7.874 µin
- Contact Type
- Pin
- Contact Current Rating (Max)
- .5 A
- Contact Layout
- Inline
- PCB Contact Termination Area Plating Thickness
- 1 µm
- PCB Contact Termination Area Plating Thickness
- 39.37 µin
- Contact Plating Thickness
- 1
- Contact Plating Thickness
- 1.3
Operation/Application
- Assembly Process Feature
- None
- Pick and Place Cover
- With
- Circuit Application
- Signal
- For Use With
- Receptacle Assembly
Termination Features
- Termination Method to Printed Circuit Board
- Surface Mount
Body Features
- Sealant
- No
- Busbar Mating Area Plating Thickness
- 200
Housing Features
- Centerline (Pitch)
- .5 mm
- Housing Material
- High Temperature Thermoplastic
- Centerline (Pitch)
- .0197 in
Product Type Features
- Connector Assembly Type
- PCB Mount Header
- Connector System
- Board-to-Board
- Row-to-Row Spacing
- 4.2 mm
- Row-to-Row Spacing
- .16506 in
- Connector & Contact Terminates To
- Printed Circuit Board
- Type
- COM Express
- Ground Component Type
- Grounding Contact
- Ground Component Type
- Grounding Plate
- Boss
- Yes
- Series
- Free Height
- Connector Type
- Connector Assembly
- Product Type
- Connector
Electrical Characteristics
- Dielectric Withstanding Voltage
- 200 VAC
- Insulation Resistance
- 2 MΩ
- Voltage
- 50 VAC
- Insulation Resistance
- 200 VAC
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