TE Connectivity
5536303-1
140,Plug,Vt,125,30Au,Gu
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Additional Information
- Part Number
- 5536303-1
Other
- Comment
- Part intended to mate with Right Angle Rcpt. Guide Pins purchased separately.
Packaging Features
- Packaging Method
- Tube
- Packaging Quantity
- 5
Dimensions
- Stack Height
- 10.92 mm
- Stack Height
- .43 in
- Height
- 8.64 mm
- PCB Thickness (Recommended)
- .76 in
- Height
- .339552 in
- Tail Length
- .76 mm
- Tail Length
- .125 in
Mechanical Attachment
- Mating Alignment
- With
- Mating Alignment Type
- Guides
- PCB Mount Retention
- Without
- PCB Mount Alignment
- With
- Connector Mounting Type
- Board Mount
- PCB Mount Alignment Type
- Locating Posts
Configuration Features
- Stackable
- No
- PCB Mount Orientation
- Vertical
- Number of Positions
- 140
- Board-to-Board Configuration
- Vertical
- Number of Rows
- 2
Usage Conditions
- Operating Temperature Range
- -65 – 125 °C
- Flame Retardant
- Yes
- Operating Temperature Range
- -85 – 257 °F
Contact Features
- Contact Base Material
- Phosphor Bronze
- PCB Contact Termination Area Plating Material
- Tin
- Solder Tail Contact Plating Material Finish
- Matte
- Contact Mating Area Plating Material
- Gold
- Contact Mating Area Plating Thickness
- .76 µm
- Contact Type
- Pin
- Contact Mating Area Plating Thickness
- 29.9212 µin
- Contact Current Rating (Max)
- 10.5 A
- Contact Mating Area Plating Material Finish
- Matte
- PCB Contact Termination Area Plating Thickness
- 2.54 – 7.62 µm
- PCB Contact Termination Area Plating Thickness
- 99.9998 – 299.9994 µin
Operation/Application
- Pick and Place Cover
- Without
- Circuit Application
- Signal
- Solder Process Feature
- Board Standoff
- For Use With
- Receptacle Assembly
Termination Features
- Termination Method to Printed Circuit Board
- Through Hole - Solder
Body Features
- Busbar Mating Area Plating Thickness
- 30
- Cover Material
- Phosphor Bronze
- Busbar Termination Area Plating Material Finish
- Matte
- Busbar Termination Area Plating Material
- Tin with Nickel Underplated
- Busbar Material
- Phosphor Bronze
- Busbar Mating Area Plating Material
- Gold
Housing Features
- Centerline (Pitch)
- 1.27 mm
- Housing Material
- Matte
- Centerline (Pitch)
- .049 in
Product Type Features
- Connector Assembly Type
- PCB Mount Header
- Connector System
- Board-to-Board
- Row-to-Row Spacing
- 2.54 mm
- Sealable
- No
- Row-to-Row Spacing
- .099822 in
- Connector & Contact Terminates To
- Printed Circuit Board
- Connector Type
- Connector Assembly
- Profile
- Low
- Boss
- No
- Product Type
- Connector
Electrical Characteristics
- Insulation Resistance
- 140 VAC
- Insulation Resistance
- 2 MΩ
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