TE Connectivity
6565692-1
Ddr1 Low Pro Rev Pb-Free
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Additional Information
- Part Number
- 6565692-1
Signal Characteristics
- SGRAM Voltage
- 2.5 V
Packaging Features
- Packaging Method
- Semi-Hard Tray Assembly
- Packaging Quantity
- 20
Dimensions
- Stack Height
- 4 mm
- Stack Height
- .157 in
Mechanical Attachment
- PCB Mount Retention Type
- Solder Peg
- PCB Mount Retention
- With
- PCB Mounting Style
- Surface Mount
- Connector Mounting Type
- Board Mount
Configuration Features
- Module Orientation
- Right Angle
- Number of Positions
- 200
- Number of Rows
- 2
- Center Key
- None
- Keying
- Reverse
- Number of Bays
- 2
- Number of Keys
- 1
Usage Conditions
- Operating Temperature Range
- -55 – 105 °C
- Operating Temperature Range
- -67 – 221 °F
Industry Standards
- UL Flammability Rating
- UL 94V-0
Contact Features
- Contact Base Material
- Copper Alloy
- PCB Contact Termination Area Plating Material
- Gold Flash
- Contact Mating Area Plating Material
- Gold
- Contact Current Rating (Max)
- .5 A
- Socket Type
- Memory Card
- Socket Style
- SO DIMM
Operation/Application
- Circuit Application
- Power
Termination Features
- Insertion Style
- Cam-In
Body Features
- Ejector Type
- Locking
- Latch Material
- Stainless Steel
- Module Key Type
- SGRAM
- Latch Plating Material
- Tin
- Ejector Location
- Both Ends
Housing Features
- Centerline (Pitch)
- .6 mm
- Housing Color
- Black
- Centerline (Pitch)
- .024 in
- Housing Material
- High Temperature Thermoplastic
Product Type Features
- DRAM Type
- Double Data Rate (DDR)
- Connector System
- Cable-to-Board
- Profile
- Low
- Row-to-Row Spacing
- 7.6 mm
- Sealable
- No
- Row-to-Row Spacing
- .299 in
- Connector & Contact Terminates To
- Printed Circuit Board
- Product Type
- Socket
Electrical Characteristics
- DRAM Voltage
- 2.5 V
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