TE Connectivity
750337-2
Mini Din, 8 Pos, Vertical, Shield
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Additional Information
- Part Number
- 750337-2
Packaging Features
- Packaging Method
- Tube
- Packaging Quantity
- 38
Dimensions
- Height
- 9.52 mm
- Tail Length
- 3.18 mm
- Height
- .37 in
- Tail Length
- .125 in
- PCB Thickness (Recommended)
- 2.68 mm
- Width
- 13.97 mm
- PCB Thickness (Recommended)
- .11 in
- Length
- 13.97 mm
- Width
- .55 in
- PCB Tail Length
- 3.18 mm
- Length
- .55 in
- PCB Tail Length
- .125 in
Mechanical Attachment
- Panel Mount Feature Type
- Screw Nut
- Panel Mount Feature
- With
- PCB Mount Alignment
- With
- Mating Alignment
- With
- Mating Alignment Type
- Polarization
- PCB Mount Retention
- With
- PCB Mount Retention Type
- Kinked Legs
- PCB Mounting Style
- Through Hole
- Connector Mounting Type
- Board Mount
- PCB Mount Alignment Type
- Hold-Down
Configuration Features
- Stacked
- No
- Connector Configuration
- Mini DIN
- Number of Positions
- 8
- Selectively Loaded
- No
- PCB Mount Orientation
- Vertical
Usage Conditions
- Operating Temperature Range
- -55 – 105 °C
- Operating Temperature Range
- -67 – 221 °F
- Temperature Rating
- High
Industry Standards
- UL File Number
- E28476
- Agency/Standard
- CSA
- Agency/Standard
- UL
- VDE Tested
- No
- UL Flammability Rating
- UL 94V-0
- UL Rating
- Recognized
Contact Features
- Contact Base Material
- Phosphor Bronze
- PCB Contact Termination Area Plating Material
- Tin-Lead
- Contact Underplating Material
- Nickel
- Contact Current Rating (Max)
- .5 A
- Contact Mating Area Plating Material
- Gold
- Contact Transmits (Typical)
- Signal (Data)
- Contact Termination Area Plating Thickness
- 2.54 µm
- Contact Termination Area Plating Thickness
- 3.81 µm
- Contact Termination Area Plating Thickness
- 150 µin
- Contact Underplating Material Thickness
- 1.27 µm
- Contact Termination Area Plating Thickness
- 100 µin
- Contact Layout
- Staggered
- Contact Underplating Material Thickness
- 50 µin
- Contact Design
- Tuning Fork
- Contact Mating Area Plating Thickness
- .76 µm
- Contact Mating Area Plating Thickness
- 30 µin
- PCB Termination Area Plating Finish
- Matte
- Contact Type
- Socket
Operation/Application
- Circuit Application
- Signal
Termination Features
- Grounding Clips
- Without
Body Features
- Shield Underplate Thickness
- 1.27 µm
- Shield Underplate Thickness
- 50 µin
- Shield Plating Finish
- Bright
- Front Panel Screw-Down
- Without
- Inner Shield Plating Material
- Tin-Lead over Nickel
- Shield Underplate Material
- Nickel
- Panel Grounding
- Without
- Outer Shield Material
- Copper Alloy
- Outer Shield Plating Material
- Tin-Lead over Nickel
- Inner Shield Material
- Brass
- Shield Material
- Brass
- Panel Ground Feature Type
- None
Housing Features
- Centerline (Pitch)
- 6.5 mm
- Centerline (Pitch)
- .26 in
- Housing Material
- Polyester
- Housing Color
- Black
Product Type Features
- Connector Style
- Receptacle
- Connector System
- Wire-to-Board
- Sealable
- No
- Connector & Contact Terminates To
- Printed Circuit Board
- Product Type
- Connector
- Connector Type
- Header
- ESD Protection
- Without
- Shape
- Circular
- Shielded
- Yes
Electrical Characteristics
- Operating Voltage
- 30 VAC
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