TE Connectivity
966306-8
Mod2 St-Lei Smd 8P
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Additional Information
- Part Number
- 966306-8
Packaging Features
- Packaging Method
- Box & Tube
- Packaging Method
- Tube
- Packaging Quantity
- 25
Dimensions
- Mating Post Length
- 5.8 mm
- Mating Post Length
- .228 in
Mechanical Attachment
- PCB Mount Retention
- Without
Configuration Features
- Selectively Loaded
- No
- PCB Mount Orientation
- Vertical
- Number of Positions
- 8
- Number of Rows
- 1
Usage Conditions
- Operating Temperature Range
- -65 – 105 °C
Contact Features
- Contact Base Material
- CuZn
- Contact Base Material
- Phosphor Bronze
- PCB Contact Termination Area Plating Material
- Tin
- Contact Shape
- Square
- Contact Mating Area Plating Material
- Gold over Palladium Nickel
- Contact Mating Area Plating Material
- Gold
- Contact Mating Area Plating Thickness
- .1 µm
- Contact Mating Area Plating Thickness
- 30 µin
- Contact Type
- Pin
- Contact Current Rating (Max)
- 5 A
- PCB Contact Termination Area Plating Thickness
- 3.5 – 5 µm
- Contact Layout
- Inline
Termination Features
- Termination Method to Printed Circuit Board
- Surface Mount
- Termination Post Length
- 2.8 mm
Body Features
- Post Size
- .64 mm
- Post Size
- .025 in
Housing Features
- Centerline (Pitch)
- 2.54 mm
- Housing Color
- Black
- Centerline (Pitch)
- .1 in
- Housing Material
- PCT GF
Product Type Features
- Connector Assembly Type
- PCB Mount Header
- Row-to-Row Spacing
- 2.54 mm
- Row-to-Row Spacing
- .1 in
- Header Type
- Breakaway
- Connector & Contact Terminates To
- Printed Circuit Board
- Boss
- No
- Series
- AMPMODU
- Connector Type
- Connector Assembly
- Product Type
- Connector
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