Weidmuller 1825830000

The LSF-SMT 3.81/06/180 3.5SN BK TU terminal is designed for printed circuit boards, featuring a pitch of 3.81 mm and accommodating up to 6 poles. This component utilizes a PUSH IN wire connection method and is suitable for through-hole solder connections with a conductor outlet direction of 180°.

It supports a maximum clamping range of 1.5 mm² and is rated for a maximum current of 12 A at 300 V (Use group B / UL 1059). The terminal's physical dimensions include a width of 23.25 mm, height of 17.5 mm, and depth of 7.8 mm, with a net weight of 4.87 g. Notably, it is constructed from LCP GF insulating material, ensuring durability and reliability across various operating conditions.

This terminal is compliant with multiple standards, including CSA, cURus, and VDE, and has a Comparative Tracking Index (CTI) of ≥ 175, making it suitable for diverse applications. The operational temperature range extends from -50 °C to 120 °C, allowing for versatility in various environments. The terminal's quality is further supported by its IPC conformity, ensuring it meets internationally recognized standards.