TE Connectivity 1-767007-3
Mict,260Plug,228,Assy,.025,Rec
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Mict,260Plug,228,Assy,.025,Rec
Additional information
Part Number | 1-767007-3 |
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Signal Characteristics
Data Rate | 10 Gb/s |
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Differential Signaling | Yes |
Packaging Features
Packaging Method | Box & Tube |
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Packaging Method | Tube |
Packaging Quantity | 6 |
Dimensions
Stack Height | 6.6 mm |
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Stack Height | 15.62 mm |
Stack Height | .615 in |
Height | 6.5278 mm |
PCB Thickness (Recommended) | .76 in |
Height | .257 in |
Length | 88.9 mm |
Length | 3.5 in |
Width | 5.2832 mm |
Width | .208 in |
Mechanical Attachment
Mating Alignment | With |
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Mating Alignment Type | Polarization |
PCB Mount Retention | Without |
PCB Mount Alignment | With |
Connector Mounting Type | Board Mount |
PCB Mount Alignment Type | Locating Posts |
Mating Retention | Without |
Configuration Features
Stackable | Yes |
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Number of Columns | 114 |
PCB Mount Orientation | Vertical |
Number of Positions | 228 |
Board-to-Board Configuration | Mezzanine |
Number of Rows | 2 |
Number of Power Positions | 6 |
Number of Signal Positions | 228 |
Usage Conditions
Operating Temperature Range | -55 – 125 °C |
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Operating Temperature Range | -67 – 257 °F |
Industry Standards
UL Flammability Rating | UL 94V-0 |
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CSA Certified | Yes |
UL Rating | Listed |
Agency/Standard | CSA |
CSA File Number | 1195944 |
UL File Number | E28476 |
Contact Features
Contact Base Material | Copper Alloy |
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PCB Contact Termination Area Plating Material | Tin-Lead |
Contact Configuration | Dual Beam |
Contact Mating Area Plating Material | Gold or Palladium Nickel or Performance Based |
Contact Mating Area Plating Thickness | .76 µm |
Contact Type | Pin |
Contact Mating Area Plating Thickness | 30 µin |
Contact Current Rating (Max) | 11.5 A |
Tin to Lead Ratio | 60 / 40 |
Contact Layout | Inline |
PCB Contact Termination Area Plating Thickness | 150 – 250 µin |
Operation/Application
Assembly Process Feature | None |
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Pick and Place Cover | Without |
Circuit Application | Signal |
For Use With | Receptacle Assembly |
Termination Features
Termination Method to Printed Circuit Board | Hybrid Surface Mount |
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Housing Features
Centerline (Pitch) | .64 mm |
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Housing Material | LCP (Liquid Crystal Polymer) |
Centerline (Pitch) | .025 in |
Product Type Features
Connector Assembly Type | PCB Mount Header |
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Connector System | Board-to-Board |
Sealable | No |
Connector & Contact Terminates To | Printed Circuit Board |
Series | MICTOR |
Connector Type | Connector Assembly |
Boss | No |
Product Type | Connector |
Electrical Characteristics
Impedance | 228 Ω |
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Insulation Resistance | 228 VAC |
Voltage | 6 VDC |
Voltage | 30 VAC |
Insulation Resistance | 2 MΩ |