TE Connectivity 149011-9
Ms,738Plug,200,Assy,125
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Ms,738Plug,200,Assy,125
Additional information
| Part Number | 149011-9 |
|---|
Packaging Features
| Packaging Method | Tube |
|---|---|
| Packaging Quantity | 4 |
Dimensions
| Stack Height | 18.75 mm |
|---|---|
| PCB Thickness (Recommended) | .76 in |
| Stack Height | .738 in |
| Height | 16.46 mm |
| Height | .65 in |
| Tail Length | .125 in |
Mechanical Attachment
| Mating Alignment | With |
|---|---|
| Mating Alignment Type | Polarization |
| PCB Mount Retention | Without |
| PCB Mount Alignment | With |
| Connector Mounting Type | Board Mount |
| PCB Mount Alignment Type | Locating Posts |
Configuration Features
| Stackable | Yes |
|---|---|
| PCB Mount Orientation | Vertical |
| Number of Positions | 200 |
| Board-to-Board Configuration | Vertical |
| Number of Rows | 2 |
Usage Conditions
| Operating Temperature Range | -65 – 125 °C |
|---|---|
| Flame Retardant | Yes |
| Operating Temperature Range | -85 – 257 °F |
Contact Features
| Contact Base Material | Phosphor Bronze |
|---|---|
| PCB Contact Termination Area Plating Material | Tin-Lead |
| Contact Mating Area Plating Material | Gold |
| Contact Mating Area Plating Thickness | .76 µm |
| Contact Mating Area Plating Thickness | 30 µin |
| Contact Type | Pin |
| Contact Current Rating (Max) | 10.5 A |
| PCB Contact Termination Area Plating Thickness | 2.54 – 7.62 µm |
| PCB Contact Termination Area Plating Thickness | 100 – 300.7 µin |
Operation/Application
| Pick and Place Cover | Without |
|---|---|
| Circuit Application | Signal |
Termination Features
| Termination Method to Printed Circuit Board | Through Hole - Solder |
|---|---|
| Termination Post Length | 3.18 mm |
Body Features
| Busbar Mating Area Plating Thickness | 30 |
|---|---|
| Busbar Termination Area Plating Material | Tin-Lead with Nickel underplated |
| Busbar Material | Phosphor Bronze |
| Cover Material | Phosphor Bronze |
| Busbar Mating Area Plating Material | Gold |
Housing Features
| Centerline (Pitch) | 1.27 mm |
|---|---|
| Housing Material | High Temperature Thermoplastic |
| Centerline (Pitch) | .05 in |
Product Type Features
| Connector Assembly Type | PCB Mount Header |
|---|---|
| Connector System | Board-to-Board |
| Row-to-Row Spacing | 2.54 mm |
| Row-to-Row Spacing | .1 in |
| Sealable | No |
| Connector & Contact Terminates To | Printed Circuit Board |
| Connector Type | Connector Assembly |
| Product Type | Connector |
Electrical Characteristics
| Insulation Resistance | 200 VAC |
|---|---|
| Voltage | 30 VAC |
| Insulation Resistance | 2 MΩ |
