TE Connectivity 2007708-1
Imp100S,R,Ra3P16C,Ug,46
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Imp100S,R,Ra3P16C,Ug,46
Additional information
| Part Number | 2007708-1 |
|---|
Signal Characteristics
| Data Rate | 20 – 25 Gb/s |
|---|---|
| Number of Differential Pairs per Column | 3 |
| Differential Signaling | Yes |
Packaging Features
| Packaging Method | Box & Tube |
|---|---|
| Packaging Method | Package |
Dimensions
| PCB Hole Diameter | .46 mm |
|---|---|
| PCB Hole Diameter | .018 in |
| Length | 30.4 mm |
| Tail Length | 1.2 mm |
| Length | 1.197 in |
| Tail Length | .047 in |
| Stack Height | 13.3 mm |
| PCB Thickness (Recommended) | 1 mm |
| Height | 13.3 mm |
| Height | .524 in |
| Width | 24.2 mm |
| Width | .953 in |
Mechanical Attachment
| PCB Mount Retention Type | Action/Compliant Tail |
|---|---|
| PCB Mount Retention | With |
| Guide Hardware | Without |
| Mating Alignment | With |
| Mating Alignment Type | Polarization |
| Connector Mounting Type | Board Mount |
| Mating Retention | Without |
Configuration Features
| Stackable | No |
|---|---|
| Number of Pairs | 48 |
| Number of Positions | 144 |
| Number of Rows | 9 |
| Number of Columns | 16 |
| Board-to-Board Configuration | Right Angle |
| PCB Mount Orientation | Right Angle |
| Guide Location | Unguided |
| Number of Signal Positions | 96 |
| Number of Ground Positions | 48 |
Usage Conditions
| Operating Temperature Range | -55 – 85 °C |
|---|---|
| Operating Temperature Range | -67 – 185 °F |
Industry Standards
| UL Rating | Recognized |
|---|---|
| UL File Number | E28476 |
| CSA Certified | Yes |
| UL Flammability Rating | UL 94V-0 |
Contact Features
| Contact Base Material | Copper Alloy |
|---|---|
| Contact Underplating Material | Nickel |
| Contact Current Rating (Max) | .75 A |
| Contact Termination Area Plating Thickness | 1.27 µm |
| Contact Mating Area Plating Thickness | .762 µm |
| Contact Termination Area Plating Thickness | 50 µin |
| Contact Termination Area Plating Material | Tin |
| Contact Mating Area Plating Thickness | 30 µin |
| Contact Design | Dual Beam |
| Underplate Material Thickness | 1.27 µm |
| Contact Mating Area Plating Material | Gold |
| Underplate Material Thickness | 50 µin |
| Contact Layout | Inline |
| Contact Style | Press-Fit |
| Contact Transmits (Typical) | Signal (Data) |
| Contact Type | Socket |
Operation/Application
| Circuit Application | Signal |
|---|---|
| For Use With | Header |
Termination Features
| Termination Method to Printed Circuit Board | Through Hole - Press-Fit |
|---|
Housing Features
| Centerline (Pitch) | 1.9 mm |
|---|---|
| Housing Color | Black |
| Centerline (Pitch) | .075 in |
| Housing Material | LCP - GF (Liquid Crystal Polymer) |
Product Type Features
| Connector System | Board-to-Board |
|---|---|
| Row-to-Row Spacing | 1.35 mm |
| Row-to-Row Spacing | .053 in |
| Connector Style | Receptacle |
| Shrouded | Unshrouded |
| Sealable | No |
| Connector & Contact Terminates To | Printed Circuit Board |
| Connector Type | Connector Assembly |
| Product Type | Connector |
| Make First / Break Last | No |
Electrical Characteristics
| Impedance | 100 Ω |
|---|---|
| Operating Voltage | 30 VDC |
| Operating Voltage | 30 VAC |
