TE Connectivity
5146893-2
1 / 1
- Part Number
- 5146893-2
Payment methods:
- Best offer from:
- Trusted Automa.Net Supplier
- Availability:
- 9100 pcs.In-StockUpdated at: 08-11-2024
- Estimated Delivery:
- On Request
- Condition:
- New Factory Sealed
New Factory Sealed - A brand-new, unused, unopened, undamaged item in its original manufacturer-sealed packaging.
Secure Payment Process
Return & Refund Policies
Shipping Policies
Warranty Policies
Signal Characteristics
- Differential Signaling
- Yes
Packaging Features
- Packaging Method
- Tape & Reel
- Packaging Quantity
- 650
Dimensions
- Stack Height
- 8 mm
- Stack Height
- 9 mm
- Stack Height
- 10 mm
- PCB Thickness (Recommended)
- .76 in
- Stack Height
- .394 in
- Length
- 44.22 mm
- Height
- 5.37 mm
- Length
- 1.74 in
- Width
- 3.81 mm
- Tail Length
- .081 in
- Height
- .211 in
- Width
- 150 in
Mechanical Attachment
- PCB Mount Retention Type
- None
- Mating Alignment
- Without
- Mating Alignment Type
- None
- PCB Mount Retention
- Without
- PCB Mount Alignment
- With
- PCB Mount Alignment Type
- Locating Posts
- Mating Retention
- Without
Configuration Features
- Stackable
- Yes
- Number of Columns
- 42
- PCB Mount Orientation
- Vertical
- Number of Positions
- 84
- Board-to-Board Configuration
- Mezzanine
- Number of Rows
- 2
Usage Conditions
- Operating Temperature Range
- -55 – 110 °C
- Operating Temperature Range
- -67 – 230 °F
Industry Standards
- Industry Standard
- IEEE 1386
- UL Flammability Rating
- UL 94V-0
- Agency/Standard
- CSA
- Agency/Standard
- UL
- UL File Number
- E28476
- UL Rating
- Listed
- CSA File Number
- LR7189
- CSA Certified
- Yes
Contact Features
- Contact Base Material
- Phosphor Bronze
- PCB Contact Termination Area Plating Material
- Tin
- Contact Configuration
- Single Beam
- Solder Tail Contact Plating Material Finish
- Matte
- Contact Mating Area Plating Material
- Gold
- Contact Mating Area Plating Thickness
- .76 µm
- Contact Mating Area Plating Thickness
- 29.92 µin
- Contact Type
- Socket
- Contact Current Rating (Max)
- 1 A
- Underplate Material Thickness
- 1.27 µm
- Contact Layout
- Inline
- Underplate Material Thickness
- 50 µin
- PCB Contact Termination Area Plating Thickness
- 3.81 µm
- PCB Contact Termination Area Plating Thickness
- 150 µin
- Contact Plating Thickness
- 1.27 – 2.54
- Contact Plating Thickness
- 3.81 – 6.35
Operation/Application
- Assembly Process Feature
- Pick and Place Cover
- Pick and Place Cover
- With
- For Use With
- Plug Assembly
Termination Features
- Termination Method to Printed Circuit Board
- Surface Mount
Housing Features
- Centerline (Pitch)
- 1 mm
- Housing Material
- Thermoplastic
- Centerline (Pitch)
- .039 in
- Housing Entry Style
- Top
Product Type Features
- Connector Assembly Type
- PCB Mount Receptacle
- Connector System
- Board-to-Board
- Row-to-Row Spacing
- 1 mm
- Connector & Contact Terminates To
- Printed Circuit Board
- Boss
- Yes
- Series
- 1mm FH
- Connector Type
- Connector Assembly
- Product Type
- Connector
Electrical Characteristics
- Insulation Resistance
- 2 MΩ
- Voltage
- 250 VAC
- Insulation Resistance
- 84 VAC
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