TE Connectivity
1-1932031-2
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- Part Number
- 1-1932031-2
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Packaging Features
- Packaging Method
- Box & Tray
- Packaging Method
- Tray
- Packaging Quantity
- 50
Dimensions
- Center Retention Hole Diameter
- 1.8 mm
- Center Retention Hole Diameter
- .07 in
- Height above PC Board
- 23.1 mm
- Height above PC Board
- .91 in
Mechanical Attachment
- PCB Mount Retention Type
- Boardlock
- PCB Mount Retention
- With
- PCB Mounting Style
- Through Hole
- Connector Mounting Type
- Board Mount
- Mounting Angle
- Vertical
- Boardlock Material
- Brass
Configuration Features
- Number of Positions
- 240
- Module Orientation
- Vertical
- Center Key
- Offset Left
- Number of Bays
- 2
- Number of Rows
- 2
- Keying
- Standard
- Number of Keys
- 1
Usage Conditions
- Operating Temperature Range
- -55 – 105 °C
- Operating Temperature Range
- -67 – 221 °F
Industry Standards
- UL Flammability Rating
- UL 94V-0
Contact Features
- Contact Base Material
- Copper Alloy
- PCB Contact Termination Area Plating Material
- Matte Tin
- Contact Underplating Material
- Nickel
- Contact Current Rating (Max)
- .5 A
- Socket Style
- DIMM
- Contact Mating Area Plating Thickness
- .38 µm
- Contact Mating Area Plating Thickness
- 15 µin
- Solder Tail Contact Plating Thickness
- 3 µm
- Contact Mating Area Plating Material
- Gold
- Solder Tail Contact Plating Thickness
- 118.1 µin
- Socket Type
- Memory Card
Operation/Application
- Circuit Application
- Signal
Termination Features
- Termination Post Length
- 4 mm
- Termination Post Length
- .157 in
- Insertion Style
- Direct Insert
Body Features
- Ejector Type
- Standard
- Latch Color
- Natural
- Latch Material
- High Temperature Thermoplastic
- Retention Post Material
- Brass
- Ejector Material Color
- Natural
- Retention Post Location
- Both Ends
- Module Key Type
- Offset Left
- Ejector Location
- Both Ends
- Ejector Material
- High Temperature Nylon
Housing Features
- Centerline (Pitch)
- 1 mm
- Centerline (Pitch)
- .039 in
- Housing Material
- High Temperature Nylon
- Housing Color
- Black
Product Type Features
- DRAM Type
- Double Data Rate (DDR) 3
- Connector System
- Board-to-Board
- Row-to-Row Spacing
- 1.9 mm
- Sealable
- No
- Row-to-Row Spacing
- .075 in
- Connector & Contact Terminates To
- Printed Circuit Board
- Center Post
- With
- Profile
- Standard
- Product Type
- Socket
Electrical Characteristics
- DRAM Voltage
- 1.5 V
Documents
Data Sheet
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