TE Connectivity
1-50871-0
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- Part Number
- 1-50871-0
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- Spring Material
- Beryllium Copper
Packaging Features
- Packaging Method
- Bag
- Packaging Method
- Loose Piece
- Packaging Quantity
- 2000
Dimensions
- Socket Length
- 7.32 mm
- Hole Size (Recommended)
- 2.56 mm
- Socket Length
- .288 in
- Wire/Cable Size
- 1.04 – 1.65 mm²
- Hole Size (Recommended)
- .101 in
- Wire/Cable Size
- 17 – 15 AWG
- Mating Pin Diameter Range
- 1.27 – 1.45 mm
- Mating Pin Diameter Range
- .05 – .057 in
- PCB Thickness (Recommended)
- .79 – 3.18 mm
- PCB Thickness (Recommended)
- .031 – .125 in
Usage Conditions
- Operating Temperature Range
- -65 – 125 °C
- Operating Temperature Range
- -85 – 257 °F
Contact Features
- Contact Base Material
- Beryllium Copper
- Contact Current Rating (Max)
- 7.5 A
- Contact Spring Plating Thickness
- .762 µm
- Contact Type
- Socket
- Contact Spring Plating Thickness
- 30 µin
- Contact Spring Plating Material
- Gold
- Socket Type
- Discrete
- Contact Transmits (Typical)
- Signal (Data)/Power
- Contact Mating Area Plating Thickness
- 30 µm
- Contact Mating Area Plating Thickness
- 30 µin
Operation/Application
- Circuit Application
- Power & Signal
Termination Features
- Termination Method to Printed Circuit Board
- Through Hole - Press-Fit
- Termination Method to Wire & Cable
- Solder
- Insertion Method
- Hand/Semi-Automatic
Body Features
- Sealant
- No
- Sleeve Material
- Copper
- Sleeve Plating Material
- Tin
Product Type Features
- Sleeve Style
- Open Bottom
- Connector System
- Cable-to-Board
- Sealable
- No
- Connector & Contact Terminates To
- Printed Circuit Board
- Product Type
- Contact
- Profile
- Zero
- Wire/Cable Type
- Discrete Wire
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