1450132-1

Packaging Features

Packaging Method

Tray

Mechanical Attachment

PCB Mount Retention Type

Boardlock

PCB Mount Retention

With

Connector Mounting Type

Board Mount

Mating Retention Type

Boardlock

Configuration Features

Number of Positions

16

PCB Mount Orientation

Right Angle

Number of Power Positions

4

Number of Signal Positions

12

Board-to-Board Configuration

Right Angle

Mating & Unmating Configuration

Sequencing

Usage Conditions

Operating Temperature Range

-20 – 105 °C

Operating Temperature Range

-4 – 221 °F

Industry Standards

Glow Wire Rating

High Temperature Part - Not Glow Wire

Contact Features

Contact Current Rating (Max)

42 A

Contact Retention

Without

Contact Termination Area Plating Material

Tin

Contact Mating Area Plating Material

Noble Metal

Contact Mating Area Plating Thickness

.076 µm

Underplate Material Thickness

3.43 µm

Contact Mating Area Plating Thickness

3 µin

Power Contact Material

Tin

Operation/Application

Circuit Application

Power & Signal

Termination Features

Termination Method to Printed Circuit Board

Through Hole - Solder

Termination Post &Tail Length

3.43 mm

Termination Post &Tail Length

.135 in

Housing Features

Centerline (Pitch)

2.54 mm

Centerline (Pitch)

6.35 mm

Centerline (Pitch)

.1 in

Centerline (Pitch)

.25 in

UL Flammability Rating

UL 94V-0

Housing Color

Black

Housing Material

High Temperature Thermoplastic

Product Type Features

Product Type

Header

Housing Type

Plug

Connector System

Board-to-Board

Sealable

No

Connector & Contact Terminates To

Printed Circuit Board

Contact Type

Pin

Electrical Characteristics

Operating Voltage

60 VAC

Operating Voltage

200 VAC

Operating Voltage

60 VDC

Operating Voltage

200 VDC

Documents