TE Connectivity
2-2013311-1
1 / 5
- Part Number
- 2-2013311-1
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Signal Characteristics
- SGRAM Voltage
- 1.5 V
Other
- Comment
- With floating peg.
Packaging Features
- Packaging Method
- Emboss on Reel
- Packaging Quantity
- 150
Dimensions
- Stack Height
- 9.2 mm
- Stack Height
- .362 in
Mechanical Attachment
- PCB Mount Retention Type
- Solder Peg
- PCB Mount Retention
- With
- PCB Mounting Style
- Surface Mount
- Connector Mounting Type
- Board Mount
Configuration Features
- Module Orientation
- Right Angle
- Number of Positions
- 204
- Number of Rows
- 2
- Center Key
- Offset Right
- Number of Bays
- 2
- Number of Keys
- 1
- Keying
- Reverse
Usage Conditions
- Operating Temperature Range
- -55 – 85 °C
- Operating Temperature Range
- -67 – 185 °F
Industry Standards
- UL Flammability Rating
- UL 94V-0
Contact Features
- Contact Base Material
- Copper Alloy
- PCB Contact Termination Area Plating Material
- Gold
- Contact Mating Area Plating Material
- Gold Flash
- Contact Current Rating (Max)
- .5 A
- Socket Style
- SO DIMM
- Socket Type
- Memory Card
Operation/Application
- Circuit Application
- Power
Termination Features
- Insertion Style
- Cam-In
Body Features
- Ejector Type
- Locking
- Module Key Type
- SGRAM
- Ejector Location
- Both Ends
- Latch Material
- Stainless Steel
- Latch Plating Material
- Tin
Housing Features
- Centerline (Pitch)
- .6 mm
- Centerline (Pitch)
- .024 in
- Housing Color
- Black
- Housing Material
- High Temperature Thermoplastic
Product Type Features
- DRAM Type
- Double Data Rate (DDR) 3
- Connector System
- Cable-to-Board
- Profile
- Reverse
- Row-to-Row Spacing
- 8.2 mm
- Row-to-Row Spacing
- .322 in
- Sealable
- No
- Connector & Contact Terminates To
- Printed Circuit Board
- Product Type
- Socket
Electrical Characteristics
- DRAM Voltage
- 1.5 V
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