2-2288172-0

Other

EMI Containment Feature Type

External Springs

Included Lightpipe

Yes

Packaging Features

Packaging Method

Tray

Dimensions

Tail Length

1.8 mm

Tail Length

.07 in

PCB Thickness (Recommended)

1.5 mm

PCB Thickness (Recommended)

.059 in

Mechanical Attachment

PCB Mounting Style

Through Hole Press-Fit

Configuration Features

Port Matrix Configuration

2 x 12

Lightpipe Configuration

Reversed Outer

Lightpipe Style

Standard

Number of Ports

24

Number of Positions

480

Usage Conditions

Operating Temperature Range

-40 – 85 °C

Operating Temperature Range

-40 – 185 °F

Industry Standards

UL Flammability Rating

UL 94V-0

Contact Features

Contact Mating Area Plating Material

Gold or Gold Flash over Palladium Nickel

Tail Plating Material

Tin

Contact Mating Area Plating Thickness

.76 µm

Contact Mating Area Plating Thickness

29.92 µin

Operation/Application

For Use With Pluggable I/O Products

zSFP+ SMT Connector

Pluggable I/O Applications

zSFP+ Thermally Enhanced

Circuit Application

Signal

Heat Sink Compatible

No

Termination Features

Termination Method to Printed Circuit Board

Through Hole - Press-Fit

Housing Features

Cage Material

Nickel Silver Alloy

Centerline (Pitch)

.8 mm

Centerline (Pitch)

.0315 in

Product Type Features

Form Factor

zSFP+

Product Type

Cage Assembly with Integrated Connector

Cage Type

Stacked

Included Heat Sink

No

Integrated Lightpipes

Yes

Connector System

Cable-to-Board

Sealable

Yes

Connector & Contact Terminates To

Printed Circuit Board

Electrical Characteristics

Data Rate (Max)

32 Gb/s

Documents