TE Connectivity
2013311-2
1 / 1
- Part Number
- 2013311-2
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Signal Characteristics
- SGRAM Voltage (V)
- 1.5
Other
- Comment
- With floating page.
Packaging Features
- Packaging Method
- Semi-Hard Tray Assembly
- Packaging Quantity
- 20
Dimensions
- Stack Height
- 9.2 mm [ .362 in ]
Mechanical Attachment
- PCB Mounting Style
- Surface Mount
- PCB Mount Retention
- With
- PCB Mount Retention Type
- Solder Peg
Configuration Features
- Number of Rows
- 2
- Number of Bays
- 2
- Center Key
- Offset Right
- Module Orientation
- Right Angle
- Number of Positions
- 204
- Keying
- Reverse
- Number of Keys
- 1
Industry Standards
- UL Flammability Rating
- UL 94V-0
Contact Features
- Solder Tail Contact Plating Material
- Gold
- Contact Base Material
- Copper Alloy
- Contact Mating Area Plating Material
- Gold
- Contact Mating Area Plating Thickness
- .254 µm [ 10 µin ]
- Socket Style
- SO DIMM
- Socket Type
- Memory Card
Termination Features
- Insertion Style
- Cam-In
Body Features
- Ejector Location
- Both Ends
- Ejector Type
- Locking
- Latch Plating Material
- Tin
- Module Key Type
- SGRAM
- Latch Material
- Stainless Steel
Housing Features
- Housing Material
- High Temperature Thermoplastic
- Housing Color
- Black
- Centerline
- .6 mm [ .024 in ]
Product Type Features
- Product Type
- Socket
- DRAM Type
- Double Data Rate (DDR) 3
- Row-to-Row Spacing
- 8.2 mm [ .322 in ]
- Applies To
- Printed Circuit Board
Electrical Characteristics
- DRAM Voltage (V)
- 1.5
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