TE Connectivity
2013882-7
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- Part Number
- 2013882-7
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- Comment
- Lead-Free Solderball
Packaging Features
- Packaging Method
- Tray
- Tray Color
- Black
Mechanical Attachment
- PCB Mounting Style
- Surface Mount - Solder Ball
- Heat Sink Attachment
- Without
Configuration Features
- Number of Positions
- 115x
- Grid Spacing
- .914 x .914 mm [ .036 x .036 in ]
Industry Standards
- UL Flammability Rating
- UL 94V-0
Contact Features
- Contact Mating Area Plating Thickness
- No Plating
- Socket Type
- LGA 115x
- Contact Base Material
- Copper Alloy
- Contact Mating Area Plating Material
- No Plating
Body Features
- Frame Style
- Square
- Plating Material
- Gold
Housing Features
- Housing Color
- Without
- Housing Material
- High Temperature Thermoplastic
Product Type Features
- Product Type
- Accessory
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