TE Connectivity
2069965-2
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- Part Number
- 2069965-2
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- Comment
- Lead-Free Solderball
Packaging Features
- Tray Color
- Black
- Packaging Method
- Box
Mechanical Attachment
- Heat Sink Attachment
- Without
- PCB Mounting Style
- Surface Mount - Solder Ball
Configuration Features
- Grid Spacing
- .914 x .914 mm [ .036 x .036 in ]
- Number of Positions
- 1155
Industry Standards
- UL Flammability Rating
- UL 94V-0
Contact Features
- Contact Base Material
- Copper Alloy
- Contact Mating Area Plating Material
- Gold
- Contact Mating Area Plating Thickness
- Gold
- Socket Type
- LGA 1155
Body Features
- Frame Style
- Square, Small
- Plating Material
- Gold
- Plating Thickness (µin)
- 15
Housing Features
- Housing Material
- High Temperature Thermoplastic
- Housing Color
- Without
Product Type Features
- Product Type
- Socket
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