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Part Number
536254-3
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Packaging Features

Packaging Method
Package
Packaging Quantity
10

Dimensions

Stack Height
10.92 mm
Stack Height
18.75 mm
Height
8.12 mm
PCB Thickness (Recommended)
.76 in
Stack Height
.738 in
Height
.32 in
Tail Length
.125 in

Mechanical Attachment

Mating Alignment
With
Mating Alignment Type
Polarization
PCB Mount Retention
Without
PCB Mount Alignment
Without
Connector Mounting Type
Board Mount

Configuration Features

Stackable
No
PCB Mount Orientation
Vertical
Number of Positions
80
Board-to-Board Configuration
Vertical
Number of Rows
2

Usage Conditions

Operating Temperature Range
-65 – 125 °C
Operating Temperature Range
-85 – 257 °F
Flame Retardant
Yes

Contact Features

Contact Base Material
Phosphor Bronze
PCB Contact Termination Area Plating Material
Tin-Lead
Contact Mating Area Plating Material
Gold
Contact Mating Area Plating Thickness
.76 µm
Contact Type
Socket
Contact Mating Area Plating Thickness
30 µin
Contact Current Rating (Max)
10.5 A
PCB Contact Termination Area Plating Thickness
100 – 300 µin

Operation/Application

Pick and Place Cover
Without
Circuit Application
Signal
For Use With
Mates with Headers
Solder Process Feature
Board Standoff

Termination Features

Termination Method to Printed Circuit Board
Through Hole - Solder

Body Features

Busbar Mating Area Plating Thickness
30
Busbar Termination Area Plating Material
Tin-Lead with Nickel underplated
Busbar Mating Area Plating Material
Gold
Busbar Material
Phosphor Bronze
Cover Material
Phosphor Bronze

Housing Features

Centerline (Pitch)
1.27 mm
Housing Material
High Temperature Thermoplastic
Centerline (Pitch)
.05 in

Product Type Features

Connector Assembly Type
PCB Mount Receptacle
Connector System
Board-to-Board
Row-to-Row Spacing
2.54 mm
Row-to-Row Spacing
.1 in
Sealable
No
Connector & Contact Terminates To
Printed Circuit Board
Boss
No
Connector Type
Connector Assembly
Product Type
Connector

Electrical Characteristics

Insulation Resistance
2 MΩ
Voltage
30 VAC
Insulation Resistance
80 VAC