Finetech GmbH & Co. KG

Finetech GmbH & Co. KG is a manufacturer of high-precision die bonding systems and advanced SMD rework equipment headquartered in Berlin, Germany. Serving the global semiconductor, photonics, and microelectronics industries, the company provides versatile placement and assembly solutions ranging from prototype development to high-volume production. Its product line features the FINEPLACER and FiNEXT platforms, which deliver sub-micron placement accuracy for complex semiconductor flip chip bonding, quantum technology packaging, and microLED integration. As an established equipment supplier, Finetech supports high-tech sectors including automotive electronics, aerospace and avionics, defense, telecommunications, and medical device manufacturing. The company offers comprehensive value-added services such as process development, application engineering, customized tool design, equipment maintenance, and hands-on technical training. With international locations across the United States, China, Japan, and Malaysia, Finetech delivers responsive regional technical support and on-site service to global research institutes and OEMs. Finetech's modular table-top die bonders and automated production platforms empower clients to seamlessly transition complex assembly processes from research labs to scalable automated manufacturing.