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Panduit GB4B0612TPI-1
Telecom Ground Busbar, 0612, Copper, Tin-Plated
Product Description
The GB4B0612TPI-1 Grounding Busbar is engineered to fulfill BICSI and ANSI/TIA-607-D standards, making it suitable for telecom and data center applications. Constructed from copper, this busbar offers high conductivity, ensuring effective grounding performance. The tin-plated coating serves to inhibit corrosion, thereby enhancing durability.
With an overall length of 304.8 mm (12 inches) and a width of 101.6 mm (4 inches), it features a thickness of 6.4 mm (0.25 inches). The pre-assembled design includes brackets and insulators, facilitating rapid installation. The insulators provide 600 V of insulation, and the busbar can be easily identified using Panduit self-laminating laser or inkjet labels.
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Offer details
- Offer from:
Trusted supplier — Italy, member since 2021, 10–19 employees - Availability:
- On requestLead time to be confirmed
- Warranty:
- 12 months
- Condition:
- New Factory Sealed
Specifications
- Brand
- Panduit
- Product Segment
- IEI
- Material
- Copper
- Stud Hole Size (mm)
- 11.17
- Stud Hole Size (In.)
- 0.44
- Finish/Coating
- Tin-Plated
- Standards Met
- BICSI/TIA-607-D, cULus Listed for Grounding and Bonding Equipment
Available Offers
(1)| Condition | Availability | Supplier | Warranty | Action | |
|---|---|---|---|---|---|
 | Condition New Factory Sealed | Availability On requestLead time to be confirmed | SupplierItalyTrusted supplier — member since 2021, 10–19 employees | Warranty 12 months |
Offer with manufacturer lead time
Directly from the manufacturer - with a confirmed, predictable, and fully transparent delivery time.
Documents
Data Sheet
Datasheet for Panduit GB4B0612TPI-1, including specifications and features.
CAD Models
3D CAD model and technical drawings, ready for your design software.
Product data updated: 19-09-2026
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