762910250

Reference - Drawing Numbers

Application Specification

AS-76291-001-001, AS-76291-002-001

Packaging Specification

PK-76291-001

Product Specification

PS-76291-001-001

S-Parameter Model

SP-76291-0002

Sales Drawing

SD-76291-001-001

Solder Process Data

Lead-freeProcess Capability

N/A

Electrical

Current - Maximum per Contact

1.5A

Voltage - Maximum

50V AC (RMS)/DC

Physical

(p)ower-(s)ignal Configuration

250s - 0p

Circuit Size Range

201-294 Circuits

Circuits (Loaded)

250

Circuits (maximum)

250

Color - Resin

Black

Durability (mating cycles max)

200

Entry Angle

N/A

Keying to Mating Part

N/A

Material - Metal

Copper Alloy

Material - Plating Mating

Gold over Nickel

Material - Plating Termination

Tin

Material - Resin

High Temperature Thermoplastic

Net Weight

31.477/g

PCB Locator

No

PCB Thickness - Recommended

2.79mm

Packaging Type

Tray

Pitch - Mating Interface

0.75mm

Pitch - Termination Interface

0.75mm

Plating min - Mating

0.762µm

Plating min - Termination

0.762µm

Polarized to Mating Part

Yes

Temperature Range - Operating

-40° to +85°C

Termination Interface: Style

Through Hole - Compliant Pin

General

Status

Active

Category

Edge Card Connectors

Series

76291

Component Type

Edgecard to PCB

Data Rate

5.0-12.0 Gbps

Edge Card Thickness

1.57mm

High Power Bay (30.0A or more)

No

Orientation

Coplanar

Overview

EdgeLine High Speed Connectors

Product Name

EdgeLine

Standard Based

General

UPC

883906484934

Product Environmental Compliance

EU ELV

Not Relevant

EU RoHS

Compliant

REACH SVHC

Not Contained Per -ED/88/2018 (15 January 2019)

Low-Halogen Status

Low-Halogen

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