TE Connectivity

1-1932680-5

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Part Number
1-1932680-5
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Packaging Features

Packaging Quantity
54
Packaging Method
Soft Tray

Dimensions

Center Retention Hole Diameter
2.45 mm [ .096 in ]
Height above PC Board
21 mm [ .82 in ]

Mechanical Attachment

Locating Posts
Without
Boardlock Material
Copper Alloy
PCB Mounting Style
Through Hole
PCB Mount Retention Type
Boardlocks
Mounting Angle
Vertical
PCB Mount Retention
With

Configuration Features

Number of Rows
2
Keying
Standard
Number of Bays
2
Center Key
Offset Left
Module Orientation
Vertical
Number of Positions
240
Number of Keys
1

Industry Standards

UL Flammability Rating
UL 94V-0

Contact Features

Contact Mating Area Plating Thickness
.51 µm [ 20 µin ]
Socket Type
Memory Card
Solder Tail Contact Plating Thickness
2.54 µm [ 100 µin ]
Solder Tail Contact Plating Material
Matte Tin
Contact Mating Area Plating Material
Gold
Contact Base Material
Copper Alloy
Socket Style
DIMM

Termination Features

Insertion Style
Direct Insert
Termination Post Length
3.18 mm [ .125 in ]

Body Features

Ejector Location
Both Ends
Ejector Type
Rotary
Retention Post Location
Both Ends
Latch Color
Black
Latch Material
Thermoplastic
Module Key Type
Offset Left
Ejector Material Color
Black
Ejector Material
Thermoplastic
Retention Post Material
Copper Alloy

Housing Features

Housing Color
Black
Housing Material
High Temperature Nylon
Centerline
2 mm [ .07 in ]

Product Type Features

Row-to-Row Spacing
.95 mm [ .037 in ]
Center Post
Without
Applies To
Printed Circuit Board
DRAM Type
Double Data Rate (DDR) 3
Product Type
Socket

Electrical Characteristics

DRAM Voltage (V)
1.5