TE Connectivity
2-1823271-2
1 / 1
- Part Number
- 2-1823271-2
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- Solder Process
- Reflow
Packaging Features
- Packaging Quantity
- 38
Dimensions
- Width
- 12 mm [ .472 in ]
- Length
- 17.4 mm [ .685 in ]
- Height
- 14.2 mm [ .559 in ]
Mechanical Attachment
- PCB Mount Retention
- With
- Mounting Angle
- Vertical / 180°
- Mounting Feature
- With
- PCB Mounting Style
- Through Hole
- Mating Alignment
- With
- Mating Retention
- With
Configuration Features
- Number of Positions
- 4
- Snap-Lock
- Without
- Keying
- B
Usage Conditions
- Operating Temperature Range
- -40 – 105 °C [ -40 – 221 °F ]
Contact Features
- Contact Transmits (Typical)
- Signal
- Contact Mating Area Plating Material
- Gold (Au)
- Mating Pin Diameter
- .6 mm [ .024 in ]
- Outer Contact Plating Material
- Tin (Sn)
- Contact Type
- Pin
- Center Contact
- With
- Center Contact Plating Material
- Gold (Au)
Termination Features
- Termination Method
- Solder
Body Features
- Ferrule
- Without
- Environmental Protection
- Other
Housing Features
- Housing Color
- Black
- Pitch
- 2 mm [ .079 in ]
Product Type Features
- Sealed
- No
- Shielded
- Yes
- Board Standoff
- Without
- Connector System
- Wire-to-Board/Device
- Connector Type
- Header
- Hybrid Connector
- No
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