TE Connectivity

2-1823271-6

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Part Number
2-1823271-6
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Other

Solder Process
Reflow

Packaging Features

Packaging Quantity
38

Dimensions

Length
17.4 mm [ .685 in ]
Width
12 mm [ .472 in ]
Height
14.2 mm [ .559 in ]

Mechanical Attachment

Mounting Feature
With
Mating Retention
With
Mounting Angle
Vertical / 180°
PCB Mounting Style
Through Hole
Mating Alignment
With
PCB Mount Retention
With

Configuration Features

Number of Positions
4
Snap-Lock
Without
Keying
F

Usage Conditions

Operating Temperature Range
-40 – 105 °C [ -40 – 221 °F ]

Contact Features

Contact Mating Area Plating Material
Gold (Au)
Contact Type
Pin
Center Contact Plating Material
Gold (Au)
Contact Transmits (Typical)
Signal
Outer Contact Plating Material
Tin (Sn)
Center Contact
With
Mating Pin Diameter
.6 mm [ .024 in ]

Termination Features

Termination Method
Solder

Body Features

Environmental Protection
Other
Ferrule
Without

Housing Features

Housing Color
Black
Pitch
2 mm [ .079 in ]

Product Type Features

Hybrid Connector
No
Connector System
Wire-to-Board/Device
Connector Type
Header
Board Standoff
Without
Shielded
Yes
Sealed
No