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Part Number
2229732-2
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Other

Comment
Lead-Free Solderball

Packaging Features

Tray Color
Black
Packaging Method
Tray

Mechanical Attachment

Heat Sink Attachment
Without
PCB Mounting Style
Surface Mount - Solder Ball

Configuration Features

Number of Positions
1356
Grid Spacing
1.016 x 1.016 mm [ .04 x .04 in ]

Industry Standards

UL Flammability Rating
UL 94V-0

Contact Features

Contact Base Material
Copper Alloy
Contact Mating Area Plating Material
Gold
Socket Type
LGA 1356-2
Contact Mating Area Plating Thickness
Gold

Body Features

Plating Material
Gold
Frame Style
Square
Plating Thickness (µin)
15

Housing Features

Housing Color
Without
Housing Material
High Temperature Thermoplastic

Product Type Features

Product Type
Socket