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Part Number
6318453-8
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Packaging Features

Packaging Method
Soft Tray

Dimensions

Stack Height
11 mm
Stack Height
19 mm
Stack Height
.748 in
PCB Thickness (Recommended)
.2 in
Stack Height
.433 in

Mechanical Attachment

PCB Mount Retention Type
Solder Peg
Mating Alignment
With
Mating Alignment Type
Polarization
PCB Mount Retention
With
PCB Mount Alignment
With
PCB Mount Alignment Type
Locating Posts

Configuration Features

PCB Mount Orientation
Vertical
Number of Positions
160
Board-to-Board Configuration
Mezzanine
Number of Rows
2

Usage Conditions

Operating Temperature Range
-40 – 80 °C
Operating Temperature Range
-40 – 176 °F

Contact Features

Contact Base Material
Copper Alloy
PCB Contact Termination Area Plating Material
Tin
Contact Mating Area Plating Material
Gold
Contact Mating Area Plating Thickness
.2 µm
Contact Type
Pin
Contact Mating Area Plating Thickness
7.874 µin
Contact Current Rating (Max)
.5 A
Contact Layout
Inline
Contact Plating Thickness
1
Contact Plating Thickness
1.3

Operation/Application

Pick and Place Cover
Without
Circuit Application
Signal
For Use With
Receptacle Assembly

Termination Features

Termination Method to Printed Circuit Board
Surface Mount

Body Features

Sealant
Yes
Busbar Mating Area Plating Thickness
200

Housing Features

Centerline (Pitch)
.6 mm
Centerline (Pitch)
.024 in
Housing Color
Black
Housing Material
High Temperature Thermoplastic

Product Type Features

Connector Assembly Type
PCB Mount Header
Connector System
Board-to-Board
Connector & Contact Terminates To
Printed Circuit Board
Ground Component Type
Grounding Contact
Ground Component Type
Grounding Plate
Boss
Yes
Connector Type
Connector Assembly
Product Type
Connector

Electrical Characteristics

Dielectric Withstanding Voltage
200 VAC
Insulation Resistance
160 VAC
Insulation Resistance
2 MΩ